Shenzhen Meiyuxin Technology Co., Ltd.【FPGA Distributor】New original supply XC7K70T-2FBG676C FPGA - Field Programmable Gate Array Quality assurance Support third-party platform testing! ! !

General description of XC7K70T-2FBG676C:

The XC7K70T-2FBG676C Xilinx® 7 Series FPGAs consist of four FPGA families that address a wide range of system requirements ranging from low cost, small size, from cost-sensitive high-volume applications to ultra-high-end connectivity bandwidth, logic capacity, and signal processing capabilities to meet The most demanding high-performance applications. 7 series FPGAs include:

• Spartan®-7 Family: Targets low cost, lowest power consumption, and high I/O performance. Offers minimal PCB footprint in a low cost, very small form factor package.

• Artix®-7 Family: Transceivers optimized for low-power applications requiring serial ports and high DSP and logic throughput. Provides the lowest high-throughput, cost-sensitive total bill of material costing application.

• Kintex®-7 family: Optimized for best price/performance, featuring 2X improvements over the previous generation, enabling new classes of FPGAs.

• Virtex®-7 Series: 2X faster system performance for maximum system performance and capacity. Functional device technology supported by the highest stacked silicon interconnect (SSI).

Based on state-of-the-art high-performance, low-power (HPL), 28nm, high-k metal gate (HKMG) process technology, the 7 series FPGAs feature an I/O bandwidth of 2.9 Tb/s, a capacity of 2 million logic cells, and 5.3 TMAC/s DSPs, while consuming 50% less power than previous generation devices, offer a fully programmable alternative to ASSPs and ASICs. 7 Series FPGAs Feature Summary

• Advanced high-performance FPGA logic based on true 6-input look-up table (LUT) technology that can be configured as distributed memory.

• 36 Kb dual-port block RAM with built-in FIFO logic buffer for on-chip data.

• High-performance SelectIO™ technology interface supporting DDR3 up to 1,866 Mb/s.

• High-speed serial connection with built-in multi-gigabit transceivers from 600 Mb/s to max. Speeds from 6.6 Gb/s to 28.05 Gb/s with special low-power modes optimized for chip-to-chip interfaces.

• A user-configurable analog interface (XADC) consisting of dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

• DSP slice with 25 x 18 multiplier, 48-bit accumulator and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

• Powerful Clock Management Module (CMT), combining Phase-Locked Loop (PLL) and Mixed-Mode Clock Manager (MMCM) blocks for high accuracy and low jitter.

• Rapidly deploy embedded processing with MicroBlaze™ processors.

• PCI Express® (PCIe) integrated block supporting up to x8 Gen3 endpoint and root port designs.

• Multiple configuration options, including support for commodity memory, 256-bit AES encrypted authentication using HMAC/SHA-256, and built-in SEU detection and correction.

• Low-cost, wire-bond, bare-die flip-chip and high-signal-integrity flip-chip packages allow easy migration of the same package between family members. All packages are available in Pb-free and select Pb options.

• Designed for high performance and lowest power consumption at 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option, lower power consumption.