CC2651R3SIPAT0MOUR

The pictures are for reference only, please refer to the product specifications.

< >

Product Category：BT Module

Manufacturer: TI

Data Manual:

CC2651R3SIPAT0MOUR.pdf

Encapsulation:

QFM-50

Delivery Date:

New and Original

Stock:

1000 Piece

Number:

Inquiry Add Contrast

Technical Parameter

Manufacturer
TI
Packing
Original Genuine Packaging
Describe
SimpleLink™ Multiprotocol 2.4GHz Wireless System-in-Package Module with Integrated Antenna
Package
QFM-50

Product Details

The SimpleLink™ CC2651R3SIPA device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651R3SIPA is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2651R3SIPA is an ultra-compact 7-mm x 7-mm certified wireless module 2.4 GHz with integrated antenna, DCDC components, Balun, and high frequency crystal oscillator.

The CC2651R3SIPA has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. The CC2651R3SIPA supports +5 dBm TX at 9.6 mA in the 2.4-GHz band. CC2651R3SIPA has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2651R3SIPA has a low sleep current of 0.9 µA with RTC and 32KB RAM retention.

TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2651R3SIPA device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCU. CC2651R3SIPA is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK.

Shipping Payment Instructions

Packing Instructions

The products we provide are all genuine products from the original factory.

Packaging Details：Standard packaging for

Port：shenzhen

Service Guarantee Description

Q1: Are the inventory and prices seen on the platform accurate?

A1: All online products on the shelves can be ordered online, but considering the high liquidity of spot inventory, it is currently impossible to be 100% accurate. If there is any abnormality, you can contact our company online and give the corresponding solution.

Q2: Can you provide the qualification certificate of the original factory or agent?

A2:At present, our own brands are TI, ST, ADI, NXP, LATTICE, CYPRESS, INFINEON, XILINX and other first-line brands. Other channels are original and agency channels. If necessary, we can communicate and confirm according to the specific brand and model.

Q3. Do you test or inspect all goods before delivery?

A3: Yes, we 100% test and inspect all items before shipping.

Q4: What are your payment terms? When will you send me the parts?

A4: Full payment. Goods will be dispatched within 1-5 business days after payment is received.

Q5: How to refund and exchange?

A5:100% money back guarantee or exchange for a similar product.

Submit Message

You can submit a message only after you register and log in

TI

Introduction:Texas Instruments (TI), abbreviated as TI, is the worlds leading semiconductor company providing innovative digital signal processing (DSP) and analog device technologies for real-world signal processing. In addition to the semiconductor business, it …