The HybridPACKTM drive is a very compact six-pack module (750V/950A) optimized for hybrid and electric vehicles. The power module implements the new EDT2 IGBT generation, an automotive micropatterned trench field stop optimized for electric drivetrain battery design applications. The chipset features benchmark current density combined with short-circuit strength and increased blocking voltage for reliable inverter operation under harsh environmental conditions. The EDT2 IGBT also exhibits excellent light load performance power loss, which helps to improve the efficiency of the system during the actual driving cycle. EDT2 IGBTs are optimized for applications with switching frequencies in the 10 kHz range.

The new HybridPACKTM Drive power module series with mechanical guide elements offers customers an easy assembly process. Additionally, crimp pin terminations for signals avoid an additional time-consuming selective soldering process, resulting in cost savings at the system level and increased system reliability. The direct cooling baseplate of this PinFin structure and the optimized ceramic material FS950R08A6P2B products take best advantage of implementing the chipset and show outstanding heat dissipation characteristics. Due to the high clearance & creepage distances, the module series is also well suited for increasing the system operating voltage and supporting the modular inverter approach.

Product Specifications:

Product Type: IGBT Modules

RoHS: Details

Package: Tray

Product Type: IGBT Modules

Series: IGBT EDT2

Subcategory: IGBTs

Brand Name: HybridPACK PressFIT

Part number alias: FS950R08A6P2B SP001720776

Unit weight: 720 g

Mechanical Properties

• 4.2kV DC 1sec isolation

• High creepage and clearance distances

• Compact design

• High power density

• Direct cooling PinFin base plate

• Guide elements for PCB and cooler assemblies

• Integrated NTC temperature sensor

• PressFIT contact technology

• RoHS Compliant

• UL 94 V0 module