FF450R08A03P2 The HybridPACKTM DSC S2 is a very compact half-bridge module targeting hybrid and electric vehicles.

The FF450R08A03P2 module is based on Infineon’s long-term experience developing IGBT power modules and implements the EDT2 IGBT generation, which is an automotive Micro-Pattern Trench-Field-Stop cell design optimized for electric drive train applications.

The FF450R08A03P2 chipset has benchmark current density combined with short circuit ruggedness and increased blocking voltage for reliable inverter operation under harsh environmental conditions. The EDT2 IGBTs also show excellent light load power losses, which helps to improve System efficiency over a real driving cycle. The EDT2 IGBT was optimized for applications with switching frequencies in the range of 10 kHz. Additionally, on-die integrated current sensor and temperature sensor allow precise monitoring of IGBT state.These features enable enhanced protection and intelligent control of the system.

The FF450R08A03P2 innovative and small package is designed for Double Sided Cooling (DSC) with superior thermal performance. The low stray inductance and increased blocking voltage support the design of systems with a very high efficiency. Furthermore, new material combinations and assembly technologies enable best thermal and electrical performance at highest reliability and mechanical robustness.

On-chip Current Sensor

On-chip Temperature Sensor

Low Inductive Design

Blocking voltage 750V

Low Switching Losses

Short-time extended Operation Temperature Tvj op = 175°C

Full automotive qualification according to AQG324

Superior thermal performance

Very compact and light power module for achieving highest power density

Enables high inverter efficiency through EDT2 IGBT technology with on-chip sensors

Optimized for automotive applications with DC link voltages up to 450 V and gate driver voltage level of -8 V / +15 V