In response to the continued downturn in the memory chip market, major memory chip manufacturers such as Micron, Kioxia, Samsung, and SK Hynix have adopted measures such as reducing production and reducing capital expenditures next year to reduce losses.

Recently, Micron released extremely dismal financial report data for the fourth quarter of 2022. The data showed that revenue fell by 19.71% year-on-year to US$6.643 billion, the first decline in two years, far below the lower limit of Micron’s financial forecast target (6.8 billion to 76 billion US dollars). One hundred million U.S. dollars). Its net profit was $1.49 billion, down 45% year-on-year.

Micron also issued a warning, saying that all customers are cutting orders, and future memory chip demand and company operations will face more serious difficulties, and announced that the company's capital expenditure in fiscal 2023 will be cut by 30%.

Following Micron’s reduction of capital expenditures for next year, Kioxia also issued a statement on the same day, saying that it will adjust the production plan of the NANAFlash fab, and the wafer production will be reduced by about 30% from October, and Kioxia will continue to review and adjust as needed. to operate.

However, Kioxia also stated that although the production is currently being adjusted, the company is confident in the medium and long-term growth prospects of the NAND Flash market, and will continue to lead the development of new products and take sustainable long-term growth as its development direction.

Shenzhen Meiyuxin Technology Co., Ltd. distributes electronic components/module packages: LGA, LCC, CPGA, LBGA, EBGA, TSBGA, PBGA, SBGA, UBGA, WLPCSP, PLCC84, PLCC44, PLCC32, PLCC28, PLCC20, BGA, QFP, TQFP144, TQFP128, TQFP100, TQFP80, TQFP48, TQFP44, TQFP32, LQFP100, LQFP80, LQFP64, LQFP48, LQFP32, QFP128, QFP64, QFP32, QFP48, QFN, QFN40, QFN32, QFN24, QFN16, HSOP6, HSOP28 HSOP20, MSOP10, MSOP8, SSOP56, SSOP48, SSOP44, SSOP36, SSOP34, SSOP24, SSOP20, TSSOP56, TSSOP48, TSSOP24, TSSOP20, TSSOP8, TSSOP16, TSSOP14, D2PAK, TO-100, TO-126, TO263, TO-264, TO-92, TO-247, TO-252, TO-72, TO-220, TO-243, TO-3, TO-22, TO-18, SOT-23, SOT223, SOT-25, SOT-26, SOT-143, DIP, ZIP, DO-35, DO-41, SMA, SMB, SOD123, SMD and other electronic components/module packages. Integrity distribution of all original IC: XILINX, APPLE, ALTERA, AD, MAXIM, ST, TI, ATMEL, NXP, SAMSUNG, FREESCALE, MROCHIP, BROADCOM, QUALCOMM, INFINEON, ON, AVAGO, INTEL and other world brand products.