Shenzhen Meiyuxin Technology Co., Ltd.【Supply Xilinx FPGA】XC7K160T-1FBG484I FPGA - Field Programmable Gate Array Quality Assurance Brand new and original Support third-party platform testing! ! !

XC7K160T-1FBG484I Product Description:

The XC7K160T-1FBG484I Xilinx® 7 Series FPGAs consist of four FPGA families that address complete system requirements ranging from low cost, small size, cost sensitive, high volume applications to ultra high end connectivity bandwidth, logic capacity and signal processing capabilities for the most demanding demanding high performance applications. 7 series FPGAs include:

• Spartan®-7 Family: Optimized for low cost, lowest power consumption, and high I/O performance. Offered in low-cost, extremely small-outline packages for minimal PCB footprint.

• Artix®-7 Family: Optimized for low-power applications requiring serial transceivers and high DSP and logic throughput. Offers the lowest total BOM cost for high-throughput, cost-sensitive applications.

• Kintex®-7 family: Optimized for best price/performance, with 2x improvement compared to previous generation, enabling a new generation of FPGAs.

• Virtex®-7 Series: Optimized for maximum system performance and capacity with 2X improvement in system performance. Highest performance devices powered by Stacked Silicon Interconnect (SSI) technology.

The XC7A100T-1CSG324C 7 Series FPGA is based on the most advanced high-performance, low-power (HPL), 28nm, high-k metal gate (HKMG) process technology, with 2.9 Tb/s I/O bandwidth, 2 million logic cells capacity and 5.3 TMAC/s DSP while consuming 50% less power than previous generation devices, providing a fully programmable alternative to ASSPs and ASICs.

XC7K160T-1FBG484I FPGA feature summary:

• Advanced high-performance FPGA logic based on true 6-input look-up table (LUT) technology that can be configured as distributed memory.

• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

• High performance SelectIO™ technology supporting up to 1,866 Mb/s DDR3 interface.

• High-speed serial connection with built-in multi-gigabit transceivers from 600 Mb/s max. 6.6 Gb/s to 28.05 Gb/s rates with special low power modes optimized for chip-to-chip interface.

• User-configurable analog interface (XADC) consisting of dual 12-bit 1MSPS analog-to-digital converters and on-chip thermal and power sensors.

• DSP slice with 25 x 18 multiplier, 48-bit accumulator and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

• Powerful Clock Management Block (CMT) that combines Phase-Locked Loop (PLL) and Mixed-Mode Clock Manager (MMCM) blocks for high accuracy and low jitter.

• Rapidly deploy embedded processing with MicroBlaze™ processors.

• Integrated blocks for PCI Express® (PCIe) up to x8 Gen3 endpoint and root port designs.

• Multiple configuration options, including support for commodity memory, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

• Low-cost, wire-bond, bare-die flip-chip and high-signal-integrity flip-chip packages with easy migration between family members in the same package. All packages are available in lead-free packages and leaded options for selected packages.

• Designed for high performance and lowest power consumption in 28nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for lower power consumption.