On February 2, it was reported that Samsung, Intel, IBM and Ericsson are jointly researching and developing next-generation chips. million dollars in funding.

NSF and the four tech giants will develop next-generation chips based on "co-design" in different fields. Samsung, Ericsson, IBM and Intel will work together in areas such as device performance, chip and system level, recyclability, environmental impact and manufacturability.

"The future of semiconductors and microelectronics will require the participation of a full range of talents spanning materials, devices and systems, as well as academia and industry," said the NSF director.

With $50 million in funding, NSF aims for this partnership between Samsung, Ericsson, IBM and Intel to "inform research needs, spur innovation, accelerate translation of results to market, and prepare the workforce of the future."

Exactly when the consumer and enterprise markets will see the fruits of these partnerships for next-generation computing remains to be determined.

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