Shenzhen Meiyuxin Technology Co., Ltd. [Agent FBGA Processor] Imported original spot EP3C25F324C8N Cyclone® III Field Programmable Gate Array (FPGA) IC 215 608256 24624 324-BGA! ! !

Product Description:

The EP3C25F324C8N Cyclone® III device family offers high functionality, low power, and low cost. Based on TSMC's low-power (LP) process technology, siliconization, and software features to minimize power consumption, the Cyclone III device family offers the ideal fit for your high-density, low-power and The solution for cost-sensitive applications. To address unique design needs, the Cyclone III device family offers the following two variants:

■ Cyclone III – lowest power, powerful, lowest cost

■ Cyclone III LS – Lowest power FPGA with security

With densities ranging from approximately 5,000 to 200,000 logic elements (LEs) and 0.5 megabit (Mb) to 8 Mb of memory, and static power consumption of less than ¼ watt, the EP3C25F324C8N family of Cyclone III devices makes it easier for you to meet your power budget. Cyclone III LS devices are the first low-power and high-performance FPGA platforms at the silicon, software, and intellectual property (IP) levels. This suite of security features protects IP from tampering, reverse engineering and cloning. In addition, Cyclone III LS devices support design separation, enabling you to reduce application size, weight, and power consumption on a single chip.

Lowest Power FPGAs

■ Lowest power consumption with TSMC low-power process technology and Altera® power-aware design flow

■ Low-power operation offers the following benefits:

■ Extended battery life for portable and handheld applications

■ Reduced or eliminated cooling system costs

■ Operation in thermally-challenged environments

■ Hot-socketing operation support

Design Security Feature

Cyclone III LS devices offer the following design security features:

■ Configuration security using advanced encryption standard (AES) with 256-bit volatile key

■ Routing architecture optimized for design separation flow with the Quartus® II software

■ Design separation flow achieves both physical and functional isolation between design partitions

■ Ability to disable external JTAG port

■ Error Detection (ED) Cycle Indicator to core

■ Provides a pass or fail indicator at every ED cycle

■ Provides visibility over intentional or unintentional change of configuration random access memory (CRAM) bits

■ Ability to perform zeroization to clear contents of the FPGA logic, CRAM, embedded memory, and AES key

■ Internal oscillator enables system monitor and health check capabilities

Increased System Integration

■ High memory-to-logic and multiplier-to-logic ratio

■ High I/O count, low-and mid-range density devices for user I/O constrained applications

■ Adjustable I/O slew rates to improve signal integrity

■ Supports I/O standards such as LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X, LVPECL, bus LVDS (BLVDS), LVDS, mini-LVDS, RSDS, and PPDS

■ Supports the multi-value on-chip termination (OCT) calibration feature to eliminate variations over process, voltage, and temperature (PVT)

■ Four phase-locked loops (PLLs) per device provide robust clock management and synthesis for device clock management, external system clock management, and I/O interfaces

■ Five outputs per PLL

■ Cascadable to save I/Os, ease PCB routing, and reduce jitter

■ Dynamically reconfigurable to change phase shift, frequency multiplication or division, or both, and input frequency in the system without reconfiguring the device

■ Remote system upgrade without the aid of an external controller

■ Dedicated cyclical redundancy code checker circuitry to detect single-event upset (SEU) issues

■ Nios® II embedded processor for Cyclone III device family, offering low cost and custom-fit embedded processing solutions

■ Wide collection of pre-built and verified IP cores from Altera and Altera Megafunction Partners Program (AMPP) partners

■ Supports high-speed external memory interfaces such as DDR, DDR2, SDR SDRAM, and QDRII SRAM

■ Auto-calibrating PHY feature eases the timing closure process and eliminates variations with PVT for DDR, DDR2, and QDRII SRAM interfaces