The iPhone 14 series models follow the design style of previous iPhones. The difference is that the iPhone 14 Pro series models integrate the internal components of the phone on the back cover of the phone, while the internal components of the iPhone 14 are integrated on the middle frame of the phone. , the screen and the glass back cover of the fuselage are in a relatively independent state. Therefore, the iPhone 14 Pro series models will be more difficult than the iPhone 14 when it comes to mobile phone repairs.

From the perspective of the internal device arrangement of the fuselage, it is not much different from the previous generation model. The main board of the mobile phone is still placed on the left side, the camera module remains unchanged in the upper left corner, and the lower part is used to place the linear motor, speaker, charging The rear panel of the interface, and the middle is the cell phone battery placement area. Due to the difference in capacity between batteries of different models, L-type lithium batteries are placed in the iPhone 14 Pro series models with larger battery capacity, while regular rectangular batteries are placed in the iPhone 14 models.

The first layer of the motherboard integrates many interfaces such as screen, tail plug, antenna, battery, camera, etc. In order to avoid the falling off of the interface cable, an integrated shielding cover is used on the top of the motherboard to strengthen the stability of the cable connection. At the same time, in order to enhance the heat dissipation and waterproof performance of the motherboard, a layer of graphene material is also covered on the shield.

The picture above is a disassembly diagram of the motherboard of the US version of the iPhone 14 Pro Max with model A2651. In terms of motherboard structure design, Apple has always chosen a stacking design of a double-layer motherboard to compress the proportion of the internal space between the motherboard and the phone. According to the IFIXIT dismantling report, the US version of the 128G iPhone 14 Pro Max flash memory chip uses NAND Flash flash memory from SanDisk.

In terms of memory, Apple has also made a major upgrade this year, equipped with Samsung K3LK2K20CM-EGCP 6GB LPDDR5 SDRAM, you must know that in previous models such as iPhone 13 Pro Max and iPhone 12 Pro Max, the SDRAM specifications used are all LPDDR4X. The running speed of LPDDR4X is 4266MT/S, and the running speed of LPDDR5 is 6400MT/S. In terms of running speed, LPDDR5 is 50% higher than LPDDR4X. It is precisely because of this improvement that it brings a 50% gain to the memory bandwidth of the A16 processor. .

Shenzhen Meiyuxin Technology Co., Ltd.  is a world-renowned electronic component recycler, which has had a long-term engagement in in-depth vertical services, such as purchasing personal inventory, factory inventory, and customs seizure with cash at high prices, consignment, sales agencies, and clearance sales. 

In terms of RF baseband, the iPhone 14 Pro Max is equipped with Qualcomm's latest X65 baseband, which is built with a 4nm process and can achieve better power consumption control than the previous 5nm X60. At the same time, the X65 baseband can call the Band n53 frequency band, which can provide emergency satellite communication functions for mobile phones in emergency situations where there is no cellular network and WiFi. However, the new baseband is still mounted on the motherboard in the form of a plug-in, so the new iPhone may not have much improvement in mobile phone signals.